Unsupported browser

You are using an outdated browser. Please upgrade your browser to improve your experience.

Sign up for an Award

Participate with your entry in one of our professional or student awards.

Sign up for an award

Sign up for a Profile

Create your own profile and publish it in the iF WORLD DESIGN GUIDE.

Sign up for a profile

Learn more:

iF SOCIAL IMPACT PRIZE (free of charge)

Present your project for free and win your share of EUR 50,000 in prize money.

Publish your project

iXoft / Notebook Cooling Pad

iXoft
iXoft

COMPUTEX d&i awards 2008

COMPUTEX d&i awards 2008

The most innovative thermal designed feature is found in its patented Heat Shift Technology which consists of phase change material that exhibits cold and solid features when it is used. It transforms into liquid form when comes into contact with heat source. Upon contact with heat source such as a computer notebook, iXoft quickly absorbs heat away from the source and accelerates thermal dissipation by distributing heat across all available surfaces on iXoft and into surrounding through natural convection. The iXoft weighs only 650g and can also be folded for easy transportation and storage.

Client / Manufacturer

Thermaltake Technology

Thermaltake Technology Co., Ltd.
Taipei County, Taiwan

Go to profile
Design

Thermaltake Technology

Thermaltake Technology Co., Ltd.
Taipei County, Taiwan

Stanly Wang、Celine、Alex

Go to profile