Unsupported browser

You are using an outdated browser. Please upgrade your browser to improve your experience.

Sign up for an Award

Participate with your entry in one of our professional or student awards.

Sign up for an award

Sign up for a Profile

Create your own profile and publish it in the iF WORLD DESIGN GUIDE.

Sign up for a profile

Learn more:


Present your project for free and win your share of EUR 50,000 in prize money.

Publish your project

Over package / Poster

Over package
Over package

The concept of the work comes from the theme of over packaging. There is only one strawberry or a piece of potato chips in the large packaging. The exaggerated way is used to show the phenomenon of over packaging. The large space is compared with the small object, hoping to leave a deep impression.


Fuzhou University

Fuzhou University
Xiamen Academy of Arts and Design
Xiamen, China

Yan Liao,
Fuzhou University