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DS1000 / Semiconductor slicing machine

DS1000

Discipline: Product

Discipline: Product

DS1000 is a wire-cut electrical discharge machine that efficiently slices wafers from ingots made of the next-generation semiconductor material SiC. 0.1-mm wires are precisely positioned, enabling simultaneous slicing of an ingot into 40 identical wafers. While conventional grinding with an abrasive-coated wire saw has problems with processing time and cutting margin width, electrical discharge slicing is heat-free, enabling faster slicing with narrower margins. Faster cutting speed reduces the cost of next-generation materials.

  • DATE OF LAUNCH 2019

  • DEVELOPMENT TIME 13 - 24 months

  • TARGET REGIONS Asia, Europe, North America

  • TARGET GROUPS Trade / Industry

Client / Manufacturer

Mitsubishi Electric Corp.

Mitsubishi Electric Corporation
Tokyo, Japan

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Design

Mitsubishi Electric Corp.

Mitsubishi Electric Corporation
Integrated Design Center
Kamakura, Japan

Naoya Tsukamoto

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