Unsupported browser

You are using an outdated browser. Please upgrade your browser to improve your experience.

Sign up for an Award

Participate with your entry in one of our professional or student awards.

Sign up for an award

Sign up for a Profile

Create your own profile and publish it in the iF WORLD DESIGN GUIDE.

Sign up for a profile

Learn more:


Present your project for free and win your share of EUR 50,000 in prize money.

Publish your project

DS1000 / Semiconductor slicing machine


Discipline: Product

Discipline: Product

DS1000 is a wire-cut electrical discharge machine that efficiently slices wafers from ingots made of the next-generation semiconductor material SiC. 0.1-mm wires are precisely positioned, enabling simultaneous slicing of an ingot into 40 identical wafers. While conventional grinding with an abrasive-coated wire saw has problems with processing time and cutting margin width, electrical discharge slicing is heat-free, enabling faster slicing with narrower margins. Faster cutting speed reduces the cost of next-generation materials.


  • DEVELOPMENT TIME 13 - 24 months

  • TARGET REGIONS Asia, Europe, North America

  • TARGET GROUPS Trade / Industry

Client / Manufacturer

Mitsubishi Electric Corp.

Mitsubishi Electric Corporation
Tokyo, Japan

Go to profile

Mitsubishi Electric Corp.

Mitsubishi Electric Corporation
Integrated Design Center
Kamakura, Japan

Naoya Tsukamoto

Go to profile