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Level 20 / chassis

Level 20
Level 20

COMPUTEX d&i awards 2018

COMPUTEX d&i awards 2018

Individual Aerodynamic Chamber Design
Level 20 utilizes trio chamber design to achieve ventilation and space management optimization. By separating PSU, Motherboard, and Storage/LCS into different compartments, Level 20 creates a unique component landscape to efficiently channel the airflow away from each main heat source and to celebrate the ensemble of the individual modules.
- PSU Chamber
Level 20 supports both vertical and horizontal PSU orientations, allowing versatile placement options. The PSU chamber features aluminum mesh panel to ensure thorough airflow and ventilation of the PSU.

Client / Manufacturer

Thermaltake Technology

Thermaltake Technology Co., Ltd.
Taipei, Taiwan

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Client / Manufacturer

Thermaltake Technology

Thermaltake Technology Co., Ltd.
Taipei, Taiwan

Go to profile
Design

Thermaltake Technology

Thermaltake Technology Co., Ltd.
Taipei, Taiwan

Go to profile