Unsupported browser

You are using an outdated browser. Please upgrade your browser to improve your experience.

Sign up for
an Award

Participate with your entry in one of our professional or student awards.

Sign up for an award

Sign up for
a Profile

Create your own profile and publish it in the iF WORLD DESIGN GUIDE.

Sign up for a profile

Learn more:

iF SOCIAL IMPACT PRIZE
(free of charge)

Present your project for free and win your share of EUR 50,000 in prize money.

Publish your project

Chip Password SE31 / Chip password

Chip Password SE31

Discipline: Product

Chip Password SE31 can accept EMV IC card payment with communication via bluetooth or USB to a smart device and it can also store digital certifications for ID authentication to enable both online and offline payment scenarios on our secure payment device. By adding capacitive screen for smartphone-like full touch user experience, Chip Password SE31 can enable Chip & PIN and Chip & Signature payment acceptance. With the latest secure processor from Broadcom, a 2.4” color touch display, an ergonomic design, a seamless metallic design, low power consumption and fast processing performance. Chip Password SE31 is truly a stylish payment device with innovative concept.

Discipline: Product

  • DATE OF LAUNCH 2016

  • DEVELOPMENT TIME up to 12 months

  • TARGET REGIONS Africa, Asia, Australia/Oceania, Europe, North America, South America

  • TARGET GROUPS Consumer / User

  • ASSESMENT CRITERIA Practical Use, Innovation / Autonomy, Usability / Ergonomics

Client / Manufacturer

POPSECU Technology Co., Ltd.

POPSECU Technology Co., Ltd.
Shenzhen, China

Design

TGS Design Consultancy

TGS Design Consultancy
Shenzhen, China

Weixue Liao, Zou Zhijun, Wang Hangdong

GO TO PROFILE