Unsupported browser

You are using an outdated browser. Please upgrade your browser to improve your experience.

Sign up for an Award

Participate with your entry in one of our professional or student awards.

Sign up for an award

Sign up for a Profile

Create your own profile and publish it in the iF WORLD DESIGN GUIDE.

Sign up for a profile

Learn more:


Present your project for free and win your share of EUR 50,000 in prize money.

Publish your project

E-CUP / Food Packaging


E-CUP has a round hole on the cover and the hole is covered by Tinfoil. People can insert fork into the hole to prevent heat losing. There’s no need for us to press the cover by hand,so we get time to do any other things while waiting for the noodles done.


Hunan University

Hunan University
Changsha, China

Xia Zhikun,
Hunan University

Wu Wensong,
Hunan University

Han Yi,
Hunan University

Sun Jingbang,
Hunan University