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TPC 812 series / CPU cooler

TPC 812 series
TPC 812 series

COMPUTEX d&i awards

COMPUTEX d&i awards

The TPC 812 from Cooler Master is the first ever CPU heat sink to use a vertical vapor chamber. This new technology combined with traditional heat pipes results in unprecedented cooling performance.
Features:
• The first-ever CPU heatsink to use vertical vapor chamber technology.
• The TPC 812 series uses 2 separate cooling technologies to transfer heat: heat pipes and vertical vapor chambers.
• 100% pure polished copper base, combined with improved soldering technologies for the best thermal transfer.
• Improved air pressure design and fan mounting system.

Client / Manufacturer

Cooler Master

Cooler Master Technology Inc.
New Taipei City, Taiwan

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Design

Cooler Master

Cooler Master Technology Inc.
New Taipei City, Taiwan

GO TO PROFILE